Occupation:Electromechanical Equipment Assembler |
Location:Menlo Park, CA |
Education Level:Associate |
Will Relocate:No |
Description
HAND SOLDERING, TOUCH UP, S.M.T. FUJI CP 4, 5, 6, PICK AND PLACE EXPERIENCE, P.T.H., MICRO SOLDERING AND TOUCH UP / REWORK PROFICIENCY, CLEAN ROOM EXPERINCE, DYE ATTACH, BONDING, WAFER FABRICATION, EPOXY MOLD, SAND BLASTING, I.C. PROGRAM AND TEST EXPERIENCE, COMPONENT I.D., ELECTRONIC AND MANUAL TEST AND CALIBRATION EXPERIENCE, EXTENSIVE KNOWLEDGE OF ALL PNEUMATIC AND MANUAL HAND TOOLS AND MESURING DEVICES.ABLE TO READ BLUE PRINTS, SCHEMATICS, AND LINEAR SCHEMATICS. DELIGATION OF WORK ASSIINGMENTS AND SCHEDUALS. RESPONSIBLE FOR LOGISTICS AND INVENTORY, BUILDING MAINTINENCE, PROTOTYPE FABRICATION OF MEDICAL DEVICES, MICROSCOPIC HAND SOLDERING TO MIL-SPEC. RIDGID AND FLEXABLE COAXAL FABRICATION, EPOXY MOLD ENCAPSULATION OF I.C. CHIPS, MACHINE OPERATOR /ASSEMBLER , H/P INDIGO 5000,3050,3000 PRINTING PRESS OPERATOR.

Accomplishments
Highlights:
CLEAN ROOM EXPERINCE, EXPERIENCE WITH VARIOUS COATING AIDS, DYE ATTACH, BONDING, WAFER FABRICATION, ELECTRONIC AND MANUAL TEST AND CALIBRATION EXPERIENCE, EXTENSIVE KNOWLEDGE OF ALL PNEUMATIC AND MANUAL HAND TOOLS AND MESURING DEVICES. ABLE TO READ BLUE PRINTS, SCHEMATICS, AND LINEAR SCHEMATICS. HAND SOLDERING, TOUCH UP, S.M.T. FUJI CP 4, 5, 6, PICK AND PLACE EXPERIENCE, P.T.H., MICRO SOLDERING AND TOUCH UP / REWORK PROFICIENCY, EPOXY MOLD, SAND BLASTING, I.C. PROGRAM AND TEST EXPERIENCE, COMPONENT I.D AND OPERATION OF VARIOUS COATING DEVICE. AND HAZ-MAT CERTIFICATIONSCompanies I like:
intel

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